km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 1 - march 2000 document title 1mx4 bit high speed static ram(5v operating). operated at extended and industrial temperature ranges. revision history the attached data sheets are prepared and approved by samsung electronics. samsung electronics co., ltd. reserve the right to c hange the specifications. samsung electronics will evaluate and reply to your requests and questions on the parameters of this device. if you have any ques- tions, please contact the samsung branch office near your office, call or contact headquarters. rev no. rev. 0.0 rev. 1.0 rev. 2.0 rev. 3.0 remark preliminary preliminary preliminary final history initial release with preliminary. 1.1 removed low power version. 1.2 removed data retention characteristics 1.3 changed i sb1 to 20ma 2.1 relax d.c parameters. 2.2 relax absolute maximum rating. 3.1 delete preliminary 3.2 update d.c parameters and 10ns part. 3.3 added extended temperature range item previous current i cc 12ns 160ma 190ma 15ns 155ma 185ma 20ns 150ma 180ma item previous current voltage on any pin relative to vss -0.5 to 7.0 -0.5 to vcc+0.5 previous current i cc i sb i sb1 i cc i sb i sb1 10ns - 70ma 20ma 160ma 60ma 10ma 12ns 190ma 150ma 15ns 185ma 140ma 20ns 180ma 130ma draft data feb. 12. 1999 mar. 29. 1999 aug. 19. 1999 mar. 27. 2000
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 2 - march 2000 1m x 4 bit (with oe )high-speed cmos static ram general description features ? fast access time 10,12,15,20ns(max.) ? low power dissipation standby (ttl) : 60ma(max.) (cmos) : 10ma(max.) operating km644002c - 10 : 160ma(max.) km644002c - 12 : 150ma(max.) km644002c - 15 : 140ma(max.) km644002c - 20 : 130ma(max.) ? single 5.0v 10% power supply ? ttl compatible inputs and outputs ? i/o compatible with 3.3v device ? fully static operation - no clock or refresh required ? three state outputs ? center power/ground pin configuration ? standard pin configuration km644002cj : 32-soj-400 pin function pin name pin function a 0 - a 19 address inputs we write enable cs chip select oe output enable i/o 1 ~ i/o 4 data inputs/outputs v cc power(+5.0v) v ss ground n.c no connection the km644002c is a 4,194,304-bit high-speed static random access memory organized as 1,048,576 words by 4 bits. the km644002c uses 4 common input and output lines and has an output enable pin which operates faster than address access time at read cycle. the device is fabricated using samsung s advanced cmos process and designed for high-speed circuit technology. it is particularly well suited for use in high-density high-speed system applications. the km644002c is packaged in a 400 mil 32-pin plastic soj. pin configuration (top view) soj 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 a 19 a 18 a 17 a 16 a 15 oe i/o 4 vss vcc i/o 3 a 14 a 13 a 12 a 11 a 10 n.c a 0 a 1 a 2 a 3 a 4 cs i/o 1 vcc vss i/o 2 we a 5 a 6 a 7 a 8 a 9 clk gen. i/o 1 ~i/o 4 cs we oe functional block diagram r o w s e l e c t data cont. column select clk gen. pre-charge circuit memory array 1024 rows 1024 x 4 columns i/o circuit a 10 a 12 a 14 a 16 a 18 a 11 a 13 a 15 a 17 a 19 a 0 a 1 a 2 a 3 a 4 a 5 a 6 a 7 a 8 a 9 km644002c - 10/12/15/20 commercial temp. km644002ce - 10/12/15/20 extended temp. km644002ci - 10/12/15/20 industrial temp. ordering information
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 3 - march 2000 dc and operating characteristics* ( t a =0 to 70 c, vcc=5.0v 10%, unless otherwise specified) * the above parameters are also guaranteed at industrial temperature range. ** v cc =5.0v 5%, temp.=25 c. parameter symbol test conditions min max unit input leakage current i li v in =v ss to v cc -2 2 m a output leakage current i lo cs =v ih or oe =v ih or we =v il v out =v ss to v cc -2 2 m a operating current i cc min. cycle, 100% duty cs =v il, v in =v ih or v il, i out =0ma 10ns - 160 ma 12ns - 150 15ns - 140 20ns - 130 standby current i sb min. cycle, cs =v ih - 60 ma i sb1 f=0mhz, cs 3 v cc -0.2v, v in 3 v cc -0.2v or v in 0.2v - 10 output low voltage level v ol i ol =8ma - 0.4 v output high voltage level v oh i oh =-4ma 2.4 - v v oh1** i oh1 =-0.1ma - 3.95 v capacitance* (t a =25 c, f=1.0mhz) * capacitance is sampled and not 100% tested. item symbol test conditions min max unit input/output capacitance c i/o v i/o =0v - 8 pf input capacitance c in v in =0v - 7 pf recommended dc operating conditions* (t a =0 to 70 c) * the above parameters are also guaranteed at industrial temperature range. ** v il (min) = -2.0v a.c(pulse width 8ns) for i 20ma. *** v ih (max) = v cc + 2.0v a.c (pulse width 8ns) for i 20ma. parameter symbol min typ max unit supply voltage v cc 4.5 5.0 5.5 v ground v ss 0 0 0 v input high voltage v ih 2.2 - v cc +0.5*** v input low voltage v il -0.5** - 0.8 v absolute maximum ratings* * stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stress r ating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this spec ification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. parameter symbol rating unit voltage on any pin relative to v ss v in , v out -0.5 to v cc +0.5 v voltage on v cc supply relative to v ss v cc -0.5 to 7.0 v power dissipation p d 1.0 w storage temperature t stg -65 to 150 c operating temperature commercial t a 0 to 70 c extended t a -25 to 85 c industrial t a -40 to 85 c
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 4 - march 2000 test conditions* * the above test conditions are also applied at industrial temperature range. parameter value input pulse levels 0v to 3v input rise and fall times 3ns input and output timing reference levels 1.5v output loads see below ac characteristics (t a =0 to 70 c, v cc =5.0v 10%, unless otherwise noted.) read cycle* * the above parameters are also guaranteed at industrial temperature range. parameter symbol km644002c-10 km644002c-12 km644002c-15 km644002c-20 unit min max min max min max min max read cycle time t rc 10 - 12 - 15 - 20 - ns address access time t aa - 10 - 12 - 15 - 20 ns chip select to output t co - 10 - 12 - 15 - 20 ns output enable to valid output t oe - 5 - 6 - 7 - 8 ns chip enable to low-z output t lz 3 - 3 - 3 - 3 - ns output enable to low-z output t olz 0 - 0 - 0 - 0 - ns chip disable to high-z output t hz 0 5 0 6 0 7 0 9 ns output disable to high-z output t ohz 0 5 0 6 0 7 0 9 ns output hold from address change t oh 3 - 3 - 3 - 3 - ns chip selection to power up time t pu 0 - 0 - 0 - 0 - ns chip selection to power downtime t pd - 10 - 12 - 15 - 20 ns output loads(b) d out 5pf* 480 w 255 w for t hz , t lz , t whz , t ow , t olz & t ohz +5.0v * including scope and jig capacitance output loads(a) d out r l = 50 w z o = 50 w v l = 1.5v 30pf* * capacitive load consists of all components of the test environment.
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 5 - march 2000 write cycle* * the above parameters are also guaranteed at industrial temperature range. parameter symbol km644002c-10 km644002c-12 km64400c-15 km644002c-20 unit min max min max min max min max write cycle time t wc 10 - 12 - 15 - 20 - ns chip select to end of write t cw 7 - 8 - 10 - 12 - ns address set-up time t as 0 - 0 - 0 - 0 - ns address valid to end of t aw 7 - 8 - 10 - 12 - ns write pulse width( oe high) t wp 7 - 8 - 10 - 12 - ns write pulse width( oe low) t wp1 10 - 12 - 15 - 20 - ns write recovery time t wr 0 - 0 - 0 - 0 - ns write to output high-z t whz 0 5 0 6 0 7 0 9 ns data to write time overlap t dw 5 - 6 - 7 - 9 - ns data hold from write time t dh 0 - 0 - 0 - 0 - ns end write to output low-z t ow 3 - 3 - 3 - 3 - ns address data out previous valid data valid data timming diagrams timing waveform of read cycle(1) (address controlled , cs = oe =v il , we =v ih ) t aa t rc t oh timing waveform of read cycle(2) ( we =v ih ) cs address oe data ou t t aa t olz t lz(4,5) t oh t ohz t rc t oe t co t pu t pd t hz(3,4,5) 50% 50% v cc current i cc i sb valid data notes (read cycle) 1. we is high for read cycle. 2. all read cycle timing is referenced from the last valid address to the first transition address. 3. t hz and t ohz are defined as the time at which the outputs achieve the open circuit condition and are not referenced to v oh or v ol levels. 4. at any given temperature and voltage condition, t hz (max.) is less than t lz (min.) both for a given device and from device to device. 5. transition is measured 200mv from steady state voltage with load(b). this parameter is sampled and not 100% tested. 6. device is continuously selected with cs =v il. 7. address valid prior to coincident with cs transition low. 8. for common i/o applications, minimization or elimination of bus contention conditions is necessary during read and write cycl e.
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 6 - march 2000 timing waveform of write cycle(1) ( oe = clock) address cs t wp(2) t dw t dh valid data we data in data out t wc t wr(5) t aw t cw(3) high-z(8) high-z oe t ohz(6) t as(4) timing waveform of write cycle(2) ( oe =low fixed) address cs t wp1(2) t dw t dh t ow t whz(6) valid data we data in data out t wc t as(4) t wr(5) t aw t cw(3) (10) (9) high-z(8) high-z timing waveform of write cycle(3) ( cs =controlled) address cs t aw t dw t dh valid data we data in data out high-z high-z(8) t cw(3) t wp(2) t as(4) t wc t wr(5) high-z high-z t lz t whz(6)
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 7 - march 2000 notes (write cycle) 1. all write cycle timing is referenced from the last valid address to the first transition address. 2. a write occurs during the overlap of a low cs and we . a write begins at the latest transition cs going low and we going low ; a write ends at the earliest transition cs going high or we going high. t wp is measured from the beginning of write to the end of write. 3. t cw i s measured from the later of cs going low to end of write. 4. t as is measured from the address valid to the beginning of write. 5. t wr is measured from the end of write to the address change. t wr applied in case a write ends as cs or we going high. 6. if oe , cs and we are in the read mode during this period, the i/o pins are in the output low-z state. inputs of opposite phase of the output must not be applied because bus contention can occur. 7. for common i/o applications, minimization or elimination of bus contention conditions is necessary during read and write cycl e. 8. if cs goes low simultaneously with we going or after we going low, the outputs remain high impedance state. 9. dout is the read data of the new address. 10. when cs is low : i/o pins are in the output state. the input signals in the opposite phase leading to the output should not be applied. functional description * x means don t care. cs we oe mode i/o pin supply current h x x* not select high-z i sb , i sb1 l h h output disable high-z i cc l h l read d out i cc l l x write d in i cc
km644002c, km644002ce, km644002ci cmos sram pr rev 3.0 - 8 - march 2000 package dimensions units:millimeters/inches #1 32-soj-400 #32 20.95 0.12 0.825 0.005 1 0 . 1 6 0 . 4 0 0 + 0.10 max 21.36 0.841 0.20 - 0.05 + 0.004 0.008 - 0.002 9.40 0.25 0.370 0.010 max 0.148 3.76 min 0.69 0.027 1.30 ( ) 0.051 1.30 ( ) 0.051 0.95 ( ) 0.0375 + 0.10 0.43 - 0.05 + 0.004 0.017 - 0.002 + 0.10 0.71 - 0.05 + 0.004 0.028 - 0.002 1.27 0.050 #16 #17 0.004 0.10 max 11.18 0.12 0.440 0.005
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